EP2AGZ300FF35I4 vs EP2AGZ300FF35C3N Comparación
Comparación detallada lado a lado de EP2AGZ300FF35I4 por Intel y EP2AGZ300FF35C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300FF35I4 | EP2AGZ300FF35C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.015,00 | $1.480,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 298,000 | — |
| Configurable Logic Blocks (LABs/CLBs) | 11,920 | — |
| Maximum User I/O | 554 | — |
| Operating Frequency (Max) | 500 MHz | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Encapsulado | 1152-ball FC-FBGA (FF35) | 1152-ball FCBGA (FF35) |
| Temperature Grade | Industrial (-40 C to +100 C) | — |
| Number of Pins/Balls | 1152 | — |
| Terminal Form | Ball (BGA) | — |
| Transceivers | 12.5 Gbps integrated | Up to 16 channels |
| Embedded Memory | M20K blocks (distributed) | — |
| DSP Blocks | Hard DSP columns (variable precision) | — |
| PCIe Support | PCIe Gen2 hard IP | — |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory (Bits) | — | 18,854,912 |
| User I/Os | — | 554 |
| Maximum User I/O Pins (Package) | — | 1,152 |
| 18x18 Multipliers | — | 554 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| PLLs | — | 8 |
| Operating Temperature Grade | — | Commercial |