EP2AGZ300FF35I4 vs EP2AGZ300FF35C3N Comparaison
Comparaison détaillée côte à côte de EP2AGZ300FF35I4 par Intel et EP2AGZ300FF35C3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGZ300FF35I4 | EP2AGZ300FF35C3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 015,00 | $1 480,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 298,000 | — |
| Configurable Logic Blocks (LABs/CLBs) | 11,920 | — |
| Maximum User I/O | 554 | — |
| Operating Frequency (Max) | 500 MHz | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Boîtier | 1152-ball FC-FBGA (FF35) | 1152-ball FCBGA (FF35) |
| Temperature Grade | Industrial (-40 C to +100 C) | — |
| Number of Pins/Balls | 1152 | — |
| Terminal Form | Ball (BGA) | — |
| Transceivers | 12.5 Gbps integrated | Up to 16 channels |
| Embedded Memory | M20K blocks (distributed) | — |
| DSP Blocks | Hard DSP columns (variable precision) | — |
| PCIe Support | PCIe Gen2 hard IP | — |
| Type de montage | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Statut RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory (Bits) | — | 18,854,912 |
| User I/Os | — | 554 |
| Maximum User I/O Pins (Package) | — | 1,152 |
| 18x18 Multipliers | — | 554 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| PLLs | — | 8 |
| Operating Temperature Grade | — | Commercial |