EP2AGZ300FH29C4G vs EP2AGZ300FH29C3G Comparación
Comparación detallada lado a lado de EP2AGZ300FH29C4G por Intel y EP2AGZ300FH29C3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300FH29C4G | EP2AGZ300FH29C3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.700,00 | $1.545,00 |
| Series | Arria II GZ | Arria II GZ |
| Logic Elements | 300,000 (approx.) | 300,000 |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Total RAM Bits | [DATA_NEEDED: embedded memory bits] | — |
| Number of I/O | [DATA_NEEDED: max user I/O count] | 281 |
| Number of Transceivers | [DATA_NEEDED: transceiver count and rate] | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: DSP block count] | — |
| Voltage - Supply | [DATA_NEEDED: core and I/O supply rails] | — |
| Temperatura de funcionamiento | 0C to +85C (commercial grade, suffix C) | 0C to +85C (commercial, speed grade 3) |
| Grade | C4 (commercial, speed grade 4) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Encapsulado / Carcasa | 780-BGA (Fine-pitch BGA, FH29) | — |
| Nivel MSL | [DATA_NEEDED: MSL moisture sensitivity level] | 3 (per JEDEC J-STD-020, where stated) |
| Estado RoHS | Compliant | Compliant |
| Process Technology | 40 nm | — |
| Lead-Free | Yes | — |
| Manufacturer | Intel (formerly Altera) | Intel (Altera) |
| Encapsulado | — | 780-BGA (HBGA, 29 mm) |
| Speed Grade | — | 3 |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Process Node | — | 40 nm |
| Embedded Memory | — | M9K / M144K block RAM |
| DSP Blocks | — | Yes (variable-precision DSP) |
| Transceivers | — | Yes (multi-gigabit) |