EP2AGZ300FH29C4G vs EP2AGZ300FH29C3G Vergleich
Detaillierter Direktvergleich von EP2AGZ300FH29C4G von Intel und EP2AGZ300FH29C3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300FH29C4G | EP2AGZ300FH29C3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.700,00 | $1.545,00 |
| Series | Arria II GZ | Arria II GZ |
| Logic Elements | 300,000 (approx.) | 300,000 |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Total RAM Bits | [DATA_NEEDED: embedded memory bits] | — |
| Number of I/O | [DATA_NEEDED: max user I/O count] | 281 |
| Number of Transceivers | [DATA_NEEDED: transceiver count and rate] | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: DSP block count] | — |
| Voltage - Supply | [DATA_NEEDED: core and I/O supply rails] | — |
| Betriebstemperatur | 0C to +85C (commercial grade, suffix C) | 0C to +85C (commercial, speed grade 3) |
| Grade | C4 (commercial, speed grade 4) | — |
| Montageart | Surface Mount | Surface Mount |
| Gehäuse / Bauform | 780-BGA (Fine-pitch BGA, FH29) | — |
| MSL-Level | [DATA_NEEDED: MSL moisture sensitivity level] | 3 (per JEDEC J-STD-020, where stated) |
| RoHS-Status | Compliant | Compliant |
| Process Technology | 40 nm | — |
| Lead-Free | Yes | — |
| Manufacturer | Intel (formerly Altera) | Intel (Altera) |
| Gehäuse | — | 780-BGA (HBGA, 29 mm) |
| Speed Grade | — | 3 |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Process Node | — | 40 nm |
| Embedded Memory | — | M9K / M144K block RAM |
| DSP Blocks | — | Yes (variable-precision DSP) |
| Transceivers | — | Yes (multi-gigabit) |