EP2AGZ350FF35I4 vs EP2AGZ300FF35I4 Comparación
Comparación detallada lado a lado de EP2AGZ350FF35I4 por Intel y EP2AGZ300FF35I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350FF35I4 | EP2AGZ300FF35I4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.395,00 | $1.015,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 298,000 |
| Adaptive Logic Modules (ALMs) | 139,400 | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory | 21,270,528 bits (~21.27 Mbit) | M20K blocks (distributed) |
| User I/O Pins | 554 | — |
| DSP Blocks | Variable-precision 18x18 multipliers | Hard DSP columns (variable precision) |
| Transceivers | Up to 16 channels, 6.375 Gbps | 12.5 Gbps integrated |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Encapsulado | 1152-ball Flip-Chip BGA (FC-FBGA, 35x35 mm) | 1152-ball FC-FBGA (FF35) |
| Tipo de montaje | Surface Mount | Surface Mount (flip-chip BGA) |
| Operating Temperature (TJ) | -40C to +100C (Industrial) | — |
| Estado RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Configurable Logic Blocks (LABs/CLBs) | — | 11,920 |
| Maximum User I/O | — | 554 |
| Operating Frequency (Max) | — | 500 MHz |
| Temperature Grade | — | Industrial (-40 C to +100 C) |
| Number of Pins/Balls | — | 1152 |
| Terminal Form | — | Ball (BGA) |
| PCIe Support | — | PCIe Gen2 hard IP |
| Lead-Free | — | Yes |