EP2AGZ350FH29C3G vs EP2AGZ350FH29C4G Comparación
Comparación detallada lado a lado de EP2AGZ350FH29C3G por Intel y EP2AGZ350FH29C4G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350FH29C3G | EP2AGZ350FH29C4G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.350,00 | $2.205,00 |
| Logic Elements | 350,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Bits) | 16,402,944 | — |
| Embedded Memory Blocks | [DATA_NEEDED: M9K/M144K block count] | — |
| User I/O Pins | 281 | — |
| Transceivers | 24 channels | 16 (8.5 Gbps) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) | — |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ | — |
| PLLs | 8 (4 enhanced, 4 fast) | — |
| Global Clocks | 16 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Speed Grade | C3 (commercial, slowest) | C4 |
| Temperatura de unión de funcionamiento | 0C to +85C | — |
| Encapsulado | 780-ball FBGA (HBGA, 29x29 mm) | 780-ball Flip-Chip BGA (FH29) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Arria II GZ |
| Logic Elements (LEs) | — | 350,000 |
| M20K Block RAM (bits) | — | 18,424 Kbits |
| MLAB Memory (bits) | — | 1,425 Kbits |
| Embedded Multipliers (18x18) | — | 1,152 |
| Maximum User I/O | — | 552 |
| Temperatura de funcionamiento | — | 0C to +85C (Commercial) |
| Transceiver Grade | — | -4 |