EP2AGZ350FH29C3G vs EP2AGZ350FH29C4G Comparison
Detailed side-by-side comparison of EP2AGZ350FH29C3G by Intel and EP2AGZ350FH29C4G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGZ350FH29C3G | EP2AGZ350FH29C4G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,350.00 | $2,205.00 |
| Logic Elements | 350,000 | β |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | β |
| Embedded Memory (Bits) | 16,402,944 | β |
| Embedded Memory Blocks | [DATA_NEEDED: M9K/M144K block count] | β |
| User I/O Pins | 281 | β |
| Transceivers | 24 channels | 16 (8.5 Gbps) |
| Transceiver Data Rate (max) | 8.5 Gbps | β |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) | β |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ | β |
| PLLs | 8 (4 enhanced, 4 fast) | β |
| Global Clocks | 16 | β |
| Process Node | 40 nm TSMC | 40 nm |
| Speed Grade | C3 (commercial, slowest) | C4 |
| Operating Junction Temperature | 0C to +85C | β |
| Package | 780-ball FBGA (HBGA, 29x29 mm) | 780-ball Flip-Chip BGA (FH29) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| MSL Level | [DATA_NEEDED: MSL rating] | β |
| Family | β | Arria II GZ |
| Logic Elements (LEs) | β | 350,000 |
| M20K Block RAM (bits) | β | 18,424 Kbits |
| MLAB Memory (bits) | β | 1,425 Kbits |
| Embedded Multipliers (18x18) | β | 1,152 |
| Maximum User I/O | β | 552 |
| Operating Temperature | β | 0C to +85C (Commercial) |
| Transceiver Grade | β | -4 |