EP2AGZ350FH29C3N vs EP2AGZ350FH29I3G Comparación
Comparación detallada lado a lado de EP2AGZ350FH29C3N por Intel y EP2AGZ350FH29I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350FH29C3N | EP2AGZ350FH29I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.920,00 | $1.450,00 |
| Family | Arria II GZ | Arria II GZ |
| Series | Arria II GZ | — |
| Logic Elements (LE) | 348,500 | 350000 (approximately) |
| Embedded Memory (bits) | 21,270,528 | — |
| Number of LABs/CLBs | 13,940 | — |
| User I/O Count | 281 | 281 |
| Encapsulado | 780-BBGA, FCBGA (FH29) | 780-FBGA (FineLine BGA, FH29) |
| Number of Pins / Terminals | 780 | — |
| Speed Grade | C3 | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Voltage - Supply | [DATA_NEEDED: core VCC, VCCAUX, VCCD_PLL values] | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free Status | Lead free | — |
| Process Node | 40 nm | 40 nm |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Rango de temperatura de funcionamiento | — | -40C to +100C |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceivers | — | Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) |
| Memory Interface | — | DDR3 with read/write leveling support (family feature) |
| Embedded Multipliers | — | 18x18 hardware multipliers (family feature) |
| Configuration Method | — | Serial or parallel via Quartus II (family feature) |
| Nivel MSL | — | 3 (per BGA package handling guidelines) |
| Lead Free | — | Yes |
| Sin halógenos | — | [DATA_NEEDED: halogen free status] |