EP2AGZ350FH29I3G - Arria II GZ FPGA, 350K LE, 780-HBGA | Intel
N.º de pieza: EP2AGZ350FH29I3G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1750 | $17.500,00 |
| 100 | $1620 | $162.000,00 |
| 250 | $1520 | $380.000,00 |
| 500 | $1450 | $725.000,00 |
EP2AGZ350FH29I3G Descripción general
Background: An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior can be reconfigured after manufacture via an HDL-defined bitstream. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors, and they are commonly categorized by logic-element density, transceiver count, and memory block count. The Arria II GZ family sits in Intel's mid-to-high density, transceiver-rich tier and is intended for ASIC prototyping, DSP-heavy pipelines, and high-speed serial interfaces.
Key features of the EP2AGZ350FH29I3G include high logic-element density for parallel DSP pipelines, multi-gigabit transceivers for backplane and chip-to-chip links, dedicated hardware multipliers for signal-processing acceleration, and an extensive clock network with PLLs for timing closure on multi-domain designs. The FH29 780-FBGA package exposes a high pin count, allowing access to nearly all of the device's user I/O and transceiver channels simultaneously, which is essential when the application requires maximum interface bandwidth.
Technically, the Arria II GZ architecture pairs a logic fabric and DSP blocks with hardened transceivers operating at multi-gigabit line rates and external memory controllers supporting DDR3 with read/write leveling. Designers typically pair this device with synchronous SRAM and DDR3 SDRAM, and they instantiate hard IP such as PCIe Gen2 and Ethernet MACs from the Quartus II IP catalog to shorten time-to-prototype.
Typical applications include high-speed digital signal processing in wireless baseband, ASIC prototyping and emulation, broadcast video processing, high-performance computing accelerator cards, and military/aerospace signal processing where the industrial temperature grade and ruggedized packaging are required.
Design consideration: pin allocation must account for dedicated transceiver banks, PLL supply pins, and global clock networks; the FH29 package exposes most dedicated pins but floorplanning the transceiver channels against the FPGA fabric is critical for signal-integrity closure.
This page synthesizes authorized distributor availability, drop-in device-family alternatives, and design guidance not bundled in the manufacturer datasheet.
Alternativas directas para EP2AGZ350FH29I3G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2AGZ350FH29I3G (mismo factor de forma y huella) — difiere en Package, Speed Grade, Operating Temperature, Logic Elements (LE), Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2AGZ350FH29I3N
✅ Sustitución directa✓ En stock
$3550 / unidad
Ver hoja de datos →EP2AGZ350FH29I4N
✅ Sustitución directa✓ En stock
$2620 / unidad
Ver hoja de datos →EP2AGZ350FH29C4N
✅ Sustitución directa✓ En stock
$1245 / unidad
Ver hoja de datos →EP2AGZ350FH29C3N
✅ Sustitución directa✓ En stock
$1920 / unidad
Ver hoja de datos →EP2AGZ350FH29C3G
✅ Sustitución directa✓ En stock
$1350 / unidad
Ver hoja de datos →EP2AGZ300FH29I3G
✅ Sustitución directa✓ En stock
$1340 / unidad
Ver hoja de datos →EP2AGZ300FH29I3N
✅ Sustitución directa✓ En stock
$1380 / unidad
Ver hoja de datos →EP2AGZ350FH29I3G Valores máximos y características eléctricas
| Family | Arria II GZ |
| Logic Elements (LE) | 350000 (approximately) |
| Process Node | 40 nm |
| User I/O Count | 281 |
| Encapsulado | 780-FBGA (FineLine BGA, FH29) |
| Temperature Grade | Industrial (-40C to +100C) |
| Tipo de montaje | Surface Mount |
| Rango de temperatura de funcionamiento | -40C to +100C |
| Transceivers | Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) |
| Memory Interface | DDR3 with read/write leveling support (family feature) |
| Embedded Multipliers | 18x18 hardware multipliers (family feature) |
| Configuration Method | Serial or parallel via Quartus II (family feature) |
| Nivel MSL | 3 (per BGA package handling guidelines) |
| Estado RoHS | Compliant |
| Lead Free | Yes |
Guía de configuración de pines de EP2AGZ350FH29I3G 780-fbga (fineline bga, fh29)
Configuración de pines para EP2AGZ350FH29I3G (encapsulado 780-fbga (fineline bga, fh29)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2AGZ350FH29I3G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2AGZ350FH29I3G es adecuado para 6 aplicacións: Wireless Baseband Signal Processing, ASIC Prototyping and Emulation, Broadcast Video Processing, High-Performance Computing Accelerator Cards, Military and Aerospace Signal Processing, Industrial Test and Measurement Instrumentation.
Wireless Baseband Signal Processing
The EP2AGZ350FH29I3G fits wireless baseband DSP because its approximately 350,000 logic elements, hardware 18x18 multipliers, and Arria II GZ DSP blocks deliver the parallel MAC throughput required by LTE and 5G NR physical-layer pipelines. Multi-gigabit transceivers connect the FPGA to RF front-end ADCs/DACs and to CPRI/eCPRI links toward the radio unit. The industrial -40C to +100C temperature grade supports outdoor base-station enclosures without thermal derating. Place the FPGA on a 12-layer PCB with transceiver channels routed to the edge connector for shortest signal-integrity path.
Recomendado
ASIC Prototyping and Emulation
ASIC prototyping demands hundreds of thousands of logic elements per FPGA so a single chip can swallow a meaningful slice of an ASIC RTL design. The EP2AGZ350FH29I3G's ~350K LE fabric is well suited to multi-FPGA partitioning of mid-complexity ASICs, and the 780-FBGA FH29 package exposes enough user I/O to interconnect prototype boards through high-density board-to-board connectors. Industrial temperature grade lets the same prototype board validate ASIC designs in lab and field. Quartus II synthesis and TimeQuest timing closure are well documented for this family.
Recomendado
Broadcast Video Processing
Broadcast video pipelines for 4K/UHD SDI, HDR tone mapping, and multi-stream transcoding require thousands of parallel DSP operations per frame, which the EP2AGZ350FH29I3G's DSP blocks and 18x18 multipliers execute efficiently. The Arria II GZ family provides dedicated video IP for SDI, display port, and HDMI interfaces, and the FH29 780-FBGA exposes enough user I/O for multiple parallel video streams. Industrial temperature lets the same board sit in mobile production trucks and outdoor broadcast racks.
Recomendado
High-Performance Computing Accelerator Cards
HPC and data-center accelerator cards use FPGAs as coprocessors for low-latency packet processing, financial feed handling, and search/filter pipelines. The EP2AGZ350FH29I3G supplies the logic capacity and embedded memory bandwidth those workloads demand, while its multi-gigabit transceivers host PCIe Gen2 hard IP and 10 Gigabit Ethernet MACs directly. The 780-FBGA FH29 package mounts to a host card with a high-pin-count edge connector, supporting both PCIe x8 and proprietary mezzanine interfaces. Industrial temperature extends deployment to edge computing nodes.
Recomendado
Military and Aerospace Signal Processing
Defense and aerospace signal-processing platforms require high logic density for radar, EW, and SIGINT pipelines, combined with industrial-or-wider operating temperature and ruggedized BGA packaging. The EP2AGZ350FH29I3G's industrial -40C to +100C grade, 780-ball FBGA construction, and Arria II GZ radiation-tolerant silicon variant supports ground-vehicle and avionics platforms. Multi-gigabit transceivers link the FPGA to RF digitizers and to high-speed recording systems.
Recomendado
Industrial Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and ATE hardware use FPGAs for real-time acquisition and processing of multi-gigabit signals. The EP2AGZ350FH29I3G's ~350K logic elements and 18x18 multipliers implement deep capture FIFOs, FFT engines, and protocol decoders, while the FH29 780-FBGA exposes enough user I/O for parallel probe interfaces. Industrial temperature lets the same hardware platform ship into factory-floor test racks without thermal derating.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2AGZ350FH29I3G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2AGZ350FH29I3N | EP2AGZ350FH29I4N | EP2AGZ350FH29C4N | EP2AGZ350FH29C3N | EP2AGZ350FH29C3G | EP2AGZ300FH29I3G | EP2AGZ300FH29I3N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (FH29) | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same |
| Logic Elements (LE) | ~350,000 | ~350,000 | ~350,000 | ~350,000 | ~350,000 | ~350,000 | ~300,000 (-14%) | ~300,000 (-14%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial enhanced | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| User I/O Count | 281 | 281 | 281 | 281 | 281 | 281 | 281 | 281 |
| RoHS / Pb-Free | Pb-free option available | Yes (N suffix = Pb-free) | Yes | Yes | Yes | Pb-free tray | Pb-free option available | Yes |
| Family / Process Node | Arria II GZ / 40 nm | Arria II GZ / 40 nm | Arria II GZ / 40 nm | Arria II GZ / 40 nm | Arria II GZ / 40 nm | Arria II GZ / 40 nm | Arria II GZ / 40 nm | Arria II GZ / 40 nm |
| Approx. Unit Price (qty 1) | $1,850 USD | Similar (Pb-free) | Similar | Similar | Similar | Similar | Slightly lower (lower density) | Slightly lower (lower density, Pb-free) |
Diferenciadores clave
- Higher logic density at the same FH29 footprint (frente a EP2AGZ300FH29I3G)
- Industrial temperature grade at the same die (frente a EP2AGZ350FH29C3N)
- Identical silicon and bitstream across suffix variants (frente a EP2AGZ350FH29I3N)
Notas de diseño
The 780-FBGA FH29 package requires a high-density PCB with microvia-in-pad construction and at least 4-6 PCB layers dedicated to the FPGA escape routing. Plan via-in-pad with 0.4mm pitch to escape the inner ball rows, and route differential transceiver pairs on the top layers with reference planes intact to maintain 90 ohm differential impedance for multi-gigabit signals. Estimated: a 12-layer stack-up with the FPGA on the top side and transceiver breakouts on outer microstrip layers is typical.
Estimated power consumption for the EP2AGZ350FH29I3G at full utilization is approximately 10-15 W core plus 1-2 W per active transceiver channel. Provide a multi-rail power solution with sequenced VCC, VCCPT, VCCAUX, and VCCA_FPLL supplies per the Arria II GZ PowerPlay early-power-estimator output. Use a dedicated PLL supply filter (ferrite + decoupling) to keep jitter low on the multi-gigabit transceivers.
The 780-FBGA package dissipates heat primarily through the PCB; a thermal pad or copper coin under the BGA is recommended for designs pushing >5 W. Industrial temperature grade (-40C to +100C) is required for outdoor enclosures; derate utilization if the enclosure is passively cooled. Estimated: at 10 W dissipation, expect a 30-40 C junction-to-ambient rise with a 4-layer PCB and moderate copper pour; use a heatsink or thermal pad if the ambient exceeds 70 C.
Do not confuse I3, I4, C3, and C4 temperature-grade suffixes - they are not interchangeable across thermal envelopes. Do not skip the configuration-mode pin strapping (MSEL pins) - the wrong strap causes the FPGA to fail to configure. Do not forget the POR (power-on-reset) capacitor on the nCONFIG pin if you are using a custom configuration scheme. Always run TimeQuest timing closure across all transceiver corners before sign-off.
Multi-gigabit transceiver channels at up to 6.375 Gbps demand strict length matching within each transceiver bank (typically within 150 mil of the channel's nominal length). Keep AC-coupling capacitors close to the receiver pins, and never route a TX pair across a plane split. The FH29 package exposes enough balls to route each transceiver channel to a board-edge SMA or high-speed connector without crossing through the FPGA fabric.
Información de cumplimiento
RoHS compliant per Intel product environmental compliance information. AEC-Q100 not applicable (FPGA is not an automotive-qualified discrete). Pb-free option available with N suffix. Halogen-free status not stated in verified web data - [DATA_NEEDED: halogen free status].
