EP2S130F1020I4N vs EP2S130F1020I4 Comparación
Comparación detallada lado a lado de EP2S130F1020I4N por Intel y EP2S130F1020I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2S130F1020I4N - Stratix II 132K LEs FPGA, 742 I/O | Intel / Altera
EP2S130F1020I4N ✗ Fin de vida
Comparación de especificaciones
| Parámetro | EP2S130F1020I4N | EP2S130F1020I4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Fin de vida | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.380,00 | $1.395,00 |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | 132,540 |
| Logic Array Blocks (LABs) | 6,627 | — |
| Total RAM Bits | 6,747,840 | — |
| User I/O Count | 742 | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | 1.2 V |
| Temperatura de funcionamiento | -40C to +100C (TJ, Industrial) | — |
| Encapsulado / Carcasa | 1020-BBGA (FineLine BGA, FC-FBGA) | — |
| Supplier Device Package | 1020-FBGA | — |
| Tipo de montaje | Surface Mount | Surface Mount (FC-FBGA) |
| Process Node | 90 nm | 90 nm CMOS, all-layer copper |
| Internal Operating Frequency | up to 711.24 MHz | — |
| Speed Grade | I4 (Industrial, speed bin 4) | I (industrial performance) |
| Configuration | SRAM-based, volatile configuration memory | — |
| Design Software | Quartus II (legacy) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (per distributor listings) |
| Lead-Free | [DATA_NEEDED: lead-free / lead-bearing finish] | — |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (bits) | — | 6,747,840 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Encapsulado | — | 1020-ball FC-FBGA (33x33 mm) |
| Device Revision | — | 4 |
| Temperatura de unión de funcionamiento | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |