EP2SGX130GF1508I4N vs EP2SGX130GF1508C3N Comparación
Comparación detallada lado a lado de EP2SGX130GF1508I4N por Intel y EP2SGX130GF1508C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX130GF1508I4N - Stratix II GX FPGA 132K LE 1508-FCBGA | Intel
EP2SGX130GF1508I4N ⚠ Última compraIntel
EP2SGX130GF1508C3N - Stratix II GX FPGA, 132K LEs, 20x Transceivers | Intel
EP2SGX130GF1508C3N ⚠ Última compraComparación de especificaciones
| Parámetro | EP2SGX130GF1508I4N | EP2SGX130GF1508C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.050,00 | $1.395,00 |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 132,540 | — |
| Adaptive Logic Modules (ALMs) | 6,627 | — |
| Embedded Memory Bits | 6,747,840 | — |
| User I/O Count | 734 | — |
| Number of LABs/CLBs | 6,627 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | I4 (fast) | — |
| Encapsulado | 1508-ball FCBGA (flip-chip BGA) | 1508-ball FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG | — |
| Estado RoHS | Compliant | Lead-free / RoHS Compliant |
| Lead-Free | Yes | — |
| Number of Transceivers | [DATA_NEEDED: number of transceiver channels] | 20 |
| Maximum Transceiver Data Rate | [DATA_NEEDED: max Gbps per channel] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | 12 |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| MSL Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Family | — | FPGA - Field Programmable Gate Array |
| Logic Elements | — | 132,540 |
| Logic Array Blocks (LABs) | — | 6,627 |
| User I/Os | — | 734 |
| Total RAM Bits | — | 6,747,840 (approximately 6.75 Mbit) |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Number of 18x18 Multipliers | — | 56 |
| Internal Fabric Clock (max) | — | 717 MHz |
| Memory Clock (max) | — | 717 MHz |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Temperature Range (TJ) | — | 0 °C to 85 °C (commercial) |
| Estimated EOL Date | — | 2023 (per GlobalSpec listing) |