EP2SGX130GF1508I4N vs EP2SGX130GF1508C3N Comparaison
Comparaison détaillée côte à côte de EP2SGX130GF1508I4N par Intel et EP2SGX130GF1508C3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2SGX130GF1508I4N - Stratix II GX FPGA 132K LE 1508-FCBGA | Intel
EP2SGX130GF1508I4N ⚠ Dernier achatIntel
EP2SGX130GF1508C3N - Stratix II GX FPGA, 132K LEs, 20x Transceivers | Intel
EP2SGX130GF1508C3N ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2SGX130GF1508I4N | EP2SGX130GF1508C3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2 050,00 | $1 395,00 |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 132,540 | — |
| Adaptive Logic Modules (ALMs) | 6,627 | — |
| Embedded Memory Bits | 6,747,840 | — |
| User I/O Count | 734 | — |
| Number of LABs/CLBs | 6,627 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | I4 (fast) | — |
| Boîtier | 1508-ball FCBGA (flip-chip BGA) | 1508-ball FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG | — |
| Statut RoHS | Compliant | Lead-free / RoHS Compliant |
| Lead-Free | Yes | — |
| Number of Transceivers | [DATA_NEEDED: number of transceiver channels] | 20 |
| Maximum Transceiver Data Rate | [DATA_NEEDED: max Gbps per channel] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | 12 |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| MSL Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Family | — | FPGA - Field Programmable Gate Array |
| Logic Elements | — | 132,540 |
| Logic Array Blocks (LABs) | — | 6,627 |
| User I/Os | — | 734 |
| Total RAM Bits | — | 6,747,840 (approximately 6.75 Mbit) |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Number of 18x18 Multipliers | — | 56 |
| Internal Fabric Clock (max) | — | 717 MHz |
| Memory Clock (max) | — | 717 MHz |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Temperature Range (TJ) | — | 0 °C to 85 °C (commercial) |
| Estimated EOL Date | — | 2023 (per GlobalSpec listing) |