EP2SGX30CF780C7 vs EP2SGX30CF780C3 Comparación
Comparación detallada lado a lado de EP2SGX30CF780C7 por Intel y EP2SGX30CF780C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX30CF780C7 | EP2SGX30CF780C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $171,00 | $175,50 |
| Series | Stratix II GX | — |
| Logic Elements | 33,000 | 33,880 |
| Embedded Memory | 1.9 Mbits | — |
| DSP Blocks (18x18 multipliers) | 256 | — |
| Maximum User I/O | 361 | — |
| Multi-Gigabit Transceivers | 4 channels | — |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps | — |
| PLLs | 4 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | — |
| Encapsulado | 780-ball FineLine BGA (CF780) | 780-ball FineLine BGA |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | C7 (fastest commercial) | -3 |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG | — |
| Estado RoHS | Compliant (lead-free Fineline BGA) | Compliant |
| Family | — | Stratix II GX |
| Logic Array Blocks (LABs) | — | 1,694 |
| Embedded RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Process Node | — | 90 nm |
| Transceivers | — | Embedded (GX family, up to 3.125 Gbps per channel) |
| Memory Interfaces | — | DDR / DDR2 / QDRII PHY |
| Tipo de montaje | — | Surface Mount (BGA) |
| Lead-Free | — | Yes |
| Sin halógenos | — | [DATA_NEEDED: halogen-free status] |