EP2SGX60DF780C3 vs EP2SGX60DF780C5 Comparación
Comparación detallada lado a lado de EP2SGX60DF780C3 por Intel y EP2SGX60DF780C5 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel
EP2SGX60DF780C5 ⚠ Última compraComparación de especificaciones
| Parámetro | EP2SGX60DF780C3 | EP2SGX60DF780C5 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $218,00 | $860,69 |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | — |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm |
| Internal Frequency (max) | ~717 MHz | — |
| Encapsulado | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA |
| Tipo de montaje | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | -C5 (commercial, mid-band) |
| Estado RoHS | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 60,440 |
| User I/O Pins | — | 364 |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.2 V |
| Internal Frequency (max, typical) | — | ~717 MHz |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Temperatura de funcionamiento | — | Commercial (0C to +85C) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |