EP2SGX60DF780C3 vs EP2SGX60DF780C5 Comparaison
Comparaison détaillée côte à côte de EP2SGX60DF780C3 par Intel et EP2SGX60DF780C5 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel
EP2SGX60DF780C5 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2SGX60DF780C3 | EP2SGX60DF780C5 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $218,00 | $860,69 |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | — |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm |
| Internal Frequency (max) | ~717 MHz | — |
| Boîtier | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA |
| Type de montage | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | -C5 (commercial, mid-band) |
| Statut RoHS | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 60,440 |
| User I/O Pins | — | 364 |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.2 V |
| Internal Frequency (max, typical) | — | ~717 MHz |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Température de fonctionnement | — | Commercial (0C to +85C) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |