EP2SGX60EF1152C3N vs EP2SGX60E1152C Comparación
Comparación detallada lado a lado de EP2SGX60EF1152C3N por Intel y EP2SGX60E1152C por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX60EF1152C3N | EP2SGX60E1152C |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.195,00 | $1.218,00 |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements | 60,440 | 60440 |
| Adaptive Logic Modules (ALMs) | 30,220 | — |
| Logic Array Blocks (LABs) | 3022 | — |
| Embedded Memory (bits) | 2,544,192 | — |
| Maximum User I/Os | 534 | — |
| Process Technology | 90 nm CMOS | — |
| Core Voltage (Vcc) | 1.2 V | — |
| Maximum Internal Frequency | 717 MHz | — |
| Propagation Delay | 0.40 ns | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: embedded multiplier count] | — |
| PLLs | 4 | — |
| Transceiver Data Rate | 3.125 Gbps per channel | 600 Mbps to 6.375 Gbps |
| Encapsulado | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch | 1152-ball FineLine BGA |
| Speed Grade | C3 (commercial, -3 bin) | C (commercial, fastest) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Tipo de montaje | Surface Mount (BGA) | — |
| On-chip RAM (bits) | — | 2544192 |
| DSP / Embedded Multiplier Blocks | — | 144 (18x18 multipliers) |
| Maximum User I/O | — | 534 |
| Process Node | — | 90 nm |
| Multi-gigabit Transceivers | — | 20 channels |
| PCI Express Hard IP | — | x1, x4, x8 endpoints and root ports |
| Embedded Memory Type | — | TriMatrix (MLAB + M512 + M4K) |
| Configuration | — | Active serial / Fast passive parallel / JTAG |
| Estado RoHS | — | Compliant |