EP2SGX60EF1152I3N vs EP2SGX60EF1152I5 Comparación
Comparación detallada lado a lado de EP2SGX60EF1152I3N por Intel y EP2SGX60EF1152I5 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX60EF1152I3N | EP2SGX60EF1152I5 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.195,00 | $178,00 |
| Family | Stratix II GX | Stratix II GX |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | 60,440 |
| Configurable Logic Blocks (CLBs) | 60,440 | 60,440 |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | 1152 |
| Terminal Form | Ball | Ball |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Nivel MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Embedded Memory (bits) | — | 2,544,192 |
| Frecuencia de reloj máxima | — | 622.08 MHz |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| Encapsulado | — | 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch |
| Package Code | — | BGA |
| Transceivers | — | Integrated multi-gigabit transceivers (per Stratix II GX family) |
| DSP Blocks | — | Yes, hardware multipliers and DSP blocks (per Stratix II GX family) |