EP2SGX60EF1152I3N vs EP2SGX60EF1152I5 对比
详细并排对比 EP2SGX60EF1152I3N 出自 Intel 和 EP2SGX60EF1152I5 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX60EF1152I3N | EP2SGX60EF1152I5 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,195.00 | $178.00 |
| Family | Stratix II GX | Stratix II GX |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | 60,440 |
| Configurable Logic Blocks (CLBs) | 60,440 | 60,440 |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | 1152 |
| Terminal Form | Ball | Ball |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| MSL 等级 | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| 安装类型 | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Embedded Memory (bits) | — | 2,544,192 |
| 最大时钟频率 | — | 622.08 MHz |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| 封装 | — | 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch |
| Package Code | — | BGA |
| Transceivers | — | Integrated multi-gigabit transceivers (per Stratix II GX family) |
| DSP Blocks | — | Yes, hardware multipliers and DSP blocks (per Stratix II GX family) |