EP2SGX60EF1152I3N vs EP2SGX60FF1152 Comparación
Comparación detallada lado a lado de EP2SGX60EF1152I3N por Intel y EP2SGX60FF1152 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX60EF1152I3N | EP2SGX60FF1152 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.195,00 | $1.950,00 |
| Family | Stratix II GX | Stratix II GX FPGA |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm CMOS, SRAM-based |
| Core Voltage | 1.2 V | — |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Series | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| Embedded Memory | — | 2,544,192 bits |
| DSP Blocks (18x18 Multipliers) | — | 192 (16 blocks) |
| Maximum User I/O | — | 364 |
| Number of LABs/CLBs | — | 3022 |
| Transceivers | — | 12 channels up to 3.125 Gbps |
| Encapsulado | — | 1152-BBGA, FineLine BGA (FF1152) |
| Temperatura de funcionamiento | — | -40C to +85C (industrial) |
| Voltage - Supply | — | 1.2 V core / multiple VCCIO rails |
| Configuration Method | — | JTAG IEEE 1149.1, Serial, Passive Parallel, Fast Passive Parallel |