EP2SGX90EF1152C3 vs EP2SGX90EF1152C3N Comparación
Comparación detallada lado a lado de EP2SGX90EF1152C3 por Intel y EP2SGX90EF1152C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX90EF1152C3 | EP2SGX90EF1152C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.180,00 | $1.280,00 |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements (LEs) | 90,960 | — |
| Total RAM Bits | 4,520,448 (4.5 Mbit) | — |
| User I/O Count | 558 | — |
| Number of LABs/CLBs | 4548 | 4548 |
| Encapsulado | 1152-FBGA (FineLine BGA) | — |
| Number of Transceivers | 12 | [DATA_NEEDED: transceiver count per family] |
| Transceiver Data Rate | 3.125 - 6.375 Gbps | — |
| Number of PLLs | 4 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Speed Grade | C3 | EF |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 90960 |
| Total Memory Bits | — | 4520448 |
| User I/Os | — | 558 |
| Core Voltage | — | 1.2 V |
| Operating Frequency (max) | — | 816.9 MHz |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Lead-Free / RoHS | — | Yes (RoHS compliant) |
| Temperature Grade | — | C3 (Commercial) |