EP2SGX90EF1152C3N vs EP2SGX90EF1152I3N Comparación
Comparación detallada lado a lado de EP2SGX90EF1152C3N por Intel y EP2SGX90EF1152I3N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EP2SGX90EF1152I3N - 90,960 Cell Stratix II GX FPGA 1.2V FC-FBGA-1152 | Altera
EP2SGX90EF1152I3N NrndComparación de especificaciones
| Parámetro | EP2SGX90EF1152C3N | EP2SGX90EF1152I3N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.280,00 | $1.320,00 |
| Series | Stratix II GX | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Frequency (max) | 816.9 MHz | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | — |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | — |
| Temperature Grade | C3 (Commercial) | — |
| Logic Elements (LEs) | — | 90,960 |
| Equivalent LEs / CLBs | — | 90,960 |
| Total RAM Bits | — | 4,520,448 (4.5 Mbits) |
| Maximum Internal Frequency | — | 816.9 MHz |
| Operating Temperature Grade | — | Industrial |
| Encapsulado | — | 1152-ball FC-FBGA |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Number of Terminals | — | 1152 |
| Transceivers | — | Multi-gigabit serial transceivers (GX family) |
| Estado RoHS | — | Compliant |