EP2SGX90FF1508C3ES vs EP2SGX130GF1508C3 Comparación
Comparación detallada lado a lado de EP2SGX90FF1508C3ES por Intel y EP2SGX130GF1508C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C3ES Obsolete
Comparación de especificaciones
| Parámetro | EP2SGX90FF1508C3ES | EP2SGX130GF1508C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.340,00 | $1.380,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 132,540 |
| Logic Array Blocks (LABs) | 4,828 | 6,627 |
| Embedded Memory (TriMatrix) | 4,520,448 bits | — |
| Total RAM Bits | 4,520,448 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Maximum Internal Frequency | 816.9 MHz | 717 MHz |
| DSP Blocks | Yes (dedicated multiplier blocks) | — |
| Embedded Transceivers | Up to 3.125 Gbps multi-gigabit transceivers | — |
| Global Clock Networks | Up to 16 | — |
| Regional Clock Networks | Up to 32 per device region | — |
| Encapsulado | 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch | 1508-ball FBGA (FCBGA) 40 x 40 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Interface | JTAG / EPCS serial flash / Passive parallel | — |
| Operating Temperature Grade | Commercial / Industrial (per part suffix) | Commercial (C3 speed grade) |
| Estado RoHS | [DATA_NEEDED: rohs] | Contains lead / RoHS non-compliant |
| Total Memory Bits | — | 6,748,860 |
| Maximum User I/O | — | 734 |
| Number of I/O Banks | — | 12 |
| Transceiver Channels | — | Up to 20 |
| Core Voltage | — | 1.2 V |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |