EP2SGX90FF1508C3ES vs EP2SGX130GF1508C3 Comparaison
Comparaison détaillée côte à côte de EP2SGX90FF1508C3ES par Intel et EP2SGX130GF1508C3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C3ES Obsolete
Comparaison des spécifications
| Paramètre | EP2SGX90FF1508C3ES | EP2SGX130GF1508C3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 340,00 | $1 380,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 132,540 |
| Logic Array Blocks (LABs) | 4,828 | 6,627 |
| Embedded Memory (TriMatrix) | 4,520,448 bits | — |
| Total RAM Bits | 4,520,448 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Maximum Internal Frequency | 816.9 MHz | 717 MHz |
| DSP Blocks | Yes (dedicated multiplier blocks) | — |
| Embedded Transceivers | Up to 3.125 Gbps multi-gigabit transceivers | — |
| Global Clock Networks | Up to 16 | — |
| Regional Clock Networks | Up to 32 per device region | — |
| Boîtier | 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch | 1508-ball FBGA (FCBGA) 40 x 40 mm, 1.0 mm pitch |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Interface | JTAG / EPCS serial flash / Passive parallel | — |
| Operating Temperature Grade | Commercial / Industrial (per part suffix) | Commercial (C3 speed grade) |
| Statut RoHS | [DATA_NEEDED: rohs] | Contains lead / RoHS non-compliant |
| Total Memory Bits | — | 6,748,860 |
| Maximum User I/O | — | 734 |
| Number of I/O Banks | — | 12 |
| Transceiver Channels | — | Up to 20 |
| Core Voltage | — | 1.2 V |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |