EP2SGX90FF1508C3N vs EP2SGX90FF1508 Comparación
Comparación detallada lado a lado de EP2SGX90FF1508C3N por Intel y EP2SGX90FF1508 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX90FF1508C3N - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel / Altera
EP2SGX90FF1508C3N ⚠ Última compraComparación de especificaciones
| Parámetro | EP2SGX90FF1508C3N | EP2SGX90FF1508 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.295,00 | $0,00 |
| Family | Stratix II GX | — |
| Logic Elements (LEs) | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 45,480 (approx.) | — |
| LABs/CLBs | 4548 | — |
| Total RAM Bits | 4,520,448 bits | — |
| Embedded Multipliers (18x18) | 384 | — |
| User I/Os | 650 | — |
| Number of I/O Banks | 12 | — |
| Transceiver Channels | 12 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| PLLs (Total) | 8 (4 fast + 4 enhanced) | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS | — |
| Encapsulado | 1508-ball FC-FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface mount |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | [DATA_NEEDED: operating temperature range] |
| Speed Grade | C3 | — |
| Lead Free | Yes | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Stratix II GX |
| Logic Cell Count | — | 90,960 cells |
| Logic Element Count | — | 90,960 elements |
| User I/O Count | — | 650 I/O |
| RAM Bits | — | 4,520,448 bits |
| LAB Count | — | 4,548 LABs |
| Tensión de alimentación | — | 1.2 V |
| Listed Frequency | — | 816.9 MHz |
| Related Speed-Grade Frequency | — | 717 MHz |
| Technology | — | CMOS |
| Package Type | — | FCBGA |
| Package Pin Count | — | 1,508 balls |
| Package Body Size | — | 40 mm x 40 mm |
| Ball Pitch | — | 1 mm |
| Package Outline Reference | — | MS-034AAU-1 |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |
| Lead-Free Status | — | Lead-free |