EP2SGX90FF1508C3N vs EP2SGX90FF1508 Comparaison
Comparaison détaillée côte à côte de EP2SGX90FF1508C3N par Intel et EP2SGX90FF1508 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2SGX90FF1508C3N - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel / Altera
EP2SGX90FF1508C3N ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2SGX90FF1508C3N | EP2SGX90FF1508 |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 295,00 | $0,00 |
| Family | Stratix II GX | — |
| Logic Elements (LEs) | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 45,480 (approx.) | — |
| LABs/CLBs | 4548 | — |
| Total RAM Bits | 4,520,448 bits | — |
| Embedded Multipliers (18x18) | 384 | — |
| User I/Os | 650 | — |
| Number of I/O Banks | 12 | — |
| Transceiver Channels | 12 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| PLLs (Total) | 8 (4 fast + 4 enhanced) | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS | — |
| Boîtier | 1508-ball FC-FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch | — |
| Type de montage | Surface Mount | Surface mount |
| Température de fonctionnement | 0C to +85C (Commercial) | [DATA_NEEDED: operating temperature range] |
| Speed Grade | C3 | — |
| Lead Free | Yes | — |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Stratix II GX |
| Logic Cell Count | — | 90,960 cells |
| Logic Element Count | — | 90,960 elements |
| User I/O Count | — | 650 I/O |
| RAM Bits | — | 4,520,448 bits |
| LAB Count | — | 4,548 LABs |
| Tension d'alimentation | — | 1.2 V |
| Listed Frequency | — | 816.9 MHz |
| Related Speed-Grade Frequency | — | 717 MHz |
| Technology | — | CMOS |
| Package Type | — | FCBGA |
| Package Pin Count | — | 1,508 balls |
| Package Body Size | — | 40 mm x 40 mm |
| Ball Pitch | — | 1 mm |
| Package Outline Reference | — | MS-034AAU-1 |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |
| Lead-Free Status | — | Lead-free |