EP2SGX90FF1508I5N vs EP2SGX90FF1508I3N Comparación
Comparación detallada lado a lado de EP2SGX90FF1508I5N por Intel y EP2SGX90FF1508I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX90FF1508I5N - Stratix II GX FPGA, 90,960 LEs, 622 MHz | Intel
EP2SGX90FF1508I5N ⚠ Última compraIntel
EP2SGX90FF1508I3N - 90k LE Stratix II GX FPGA, 1.2V, FC-FBGA-1508 | Intel
EP2SGX90FF1508I3N ✓ ActivoComparación de especificaciones
| Parámetro | EP2SGX90FF1508I5N | EP2SGX90FF1508I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.450,00 | $1.460,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LEs) | 90,960 | — |
| Total Logic Cells | 90,960 | — |
| Equivalent Logic Cells | 90,960 | — |
| Embedded Memory Bits | 4,520,448 bits | — |
| Frecuencia de reloj máxima | 622.08 MHz | — |
| Process Node | 90 nm CMOS | — |
| Nominal Core Supply Voltage | 1.2 V | — |
| User I/O Pins | 650 | — |
| Total Package Pins | 1,508 | — |
| Encapsulado | 1508-ball FC-FBGA (FF1508) | 1508-ball FC-FBGA (flip-chip) |
| Rango de temperatura de funcionamiento | -40 °C to +85 °C (Industrial) | — |
| Speed Grade | I5 (industrial, moderate speed) | I3N (industrial, fast) |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| LE Count Class | High Density (90K-class) | — |
| Logic Elements (LE) | — | 90960 |
| Configurable Logic Blocks (CLBs) | — | 90960 |
| Embedded Memory (bits) | — | 4520448 |
| Memory Blocks | — | TriMatrix (M512/M4K/M-RAM) |
| Embedded Multipliers | — | 18x18-bit |
| Process Technology | — | 90 nm |
| Core Voltage | — | 1.2 V |
| Maximum Internal Clock Frequency | — | 816.9 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Terminal Form | — | Ball (BGA) |
| Number of Terminals | — | 1508 |
| Package Shape | — | Square |
| Configuration Method | — | EPC enhanced configuration device / JTAG |
| Multi-Gigabit Transceivers | — | Embedded (PCIe / RapidIO / GBE capable) |