EP3C10F256C8N vs EP3C10F256C6 Comparación
Comparación detallada lado a lado de EP3C10F256C8N por Altera y EP3C10F256C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C10F256C8N | EP3C10F256C6 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $15,40 | $36,75 |
| Series | Cyclone III | — |
| Logic Elements | 10,320 | — |
| Logic Array Blocks (LABs) | 645 | — |
| Embedded Memory (Bits) | 423,936 | — |
| User I/Os | 182 | — |
| Operating Frequency (max) | 402 MHz | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power CMOS |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 4 | 2 |
| Encapsulado | 256-pin FineLine BGA (FBGA-256, 17 x 17 x 1.8 mm) | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | 0 C to 85 C (Commercial, 'C' grade) | -40 C to +125 C (industrial, suffix 'C') |
| Estado RoHS | Compliant | Compliant (lead-free FBGA) |
| Lead-Free | Yes | — |
| Nivel MSL | MSL3 (per JEDEC J-STD-020, typical for FineLine BGA) | 3 (168 hours) |
| Configuration Method | SRAM-based, supports Active Serial (AS), Passive Serial (PS), JTAG | — |
| Equivalent Gate Count | ~0.5 M Gates (approximate) | — |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 10,320 |
| Total Memory Bits | — | 423,936 bits |
| Maximum User I/Os | — | 182 |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V (typ. 1.2 V) |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (bank-dependent) |
| Configuration Memory | — | SRAM-based (external EPCS flash required) |
| Speed Grade | — | 6 |