EP3C25F324I7 vs EP3C16F484I7 Comparación
Comparación detallada lado a lado de EP3C25F324I7 por Intel y EP3C16F484I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C25F324I7 | EP3C16F484I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $64,80 | $58,10 |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | — |
| Logic Array Blocks (LABs) | 1,539 | 963 |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | — |
| Embedded 18x18 Multipliers | 66 | 56 |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 215 | — |
| Process Technology | TSMC 65 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Temperatura de unión de funcionamiento | -40 °C to +100 °C (industrial) | — |
| Encapsulado | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 484-ball FineLine BGA (F484) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Family | — | Cyclone III |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 15,408 |
| Total Embedded Memory | — | 516,096 bits (63 KB) |
| Embedded Memory Blocks | — | M9K x 56 |
| User I/Os | — | 346 |
| General-Purpose PLLs | — | 4 |
| Temperatura de funcionamiento | — | -40C to +100C (industrial) |
| Speed Grade | — | 7 (fastest commercial/industrial) |
| Process Node | — | 60 nm TSMC low-power |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |