EP3C40F324I7N vs EP3C25F324I7N Comparación
Comparación detallada lado a lado de EP3C40F324I7N por Intel y EP3C25F324I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C40F324I7N | EP3C25F324I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,10 | $58,20 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Logic Array Blocks / LABs | [DATA_NEEDED: LAB count] | — |
| Total Memory Bits | 1,161,216 bits | — |
| Embedded Multipliers (18x18) | 126 | — |
| General-Purpose PLLs | 4 | — |
| Maximum User I/O | 195 | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Temperatura de funcionamiento | -40 C to +100 C (Industrial) | -40C to +100C (Industrial) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm low-power CMOS (TSMC) | 65 nm |
| Encapsulado | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 2.2 mm height | 324-ball FBGA (Fine-Pitch BGA) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount | — |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory | — | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 215 |
| LVDS Pairs | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Speed Grade | — | 7 (slower speed grade, lower power) |
| Lead-Free | — | Yes |
| Nivel MSL | — | 3 (168 hours) |