EP3C40F780C8N vs EP3C40F780I8N Comparación
Comparación detallada lado a lado de EP3C40F780C8N por Intel y EP3C40F780I8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C40F780C8N | EP3C40F780I8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $64,85 | $192,00 |
| Series | Cyclone® III | — |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Total Memory Bits | 1,161,216 bits | — |
| Number of LABs/CLBs | 2,475 | — |
| Embedded Memory Blocks | M9K x 126 | — |
| Embedded 18x18 Multipliers | 126 (up to 396 9x9) | — |
| Number of PLLs | 4 | 4 |
| Maximum User I/Os | 535 | — |
| Number of I/O Banks | 9 | — |
| Core Voltage | 1.15V to 1.25V | — |
| Temperatura de funcionamiento | 0°C to +85°C (Commercial) | — |
| Speed Grade | 8 (C8) | — |
| Encapsulado | 780-ball FBGA, 1.0mm pitch | 780-ball FBGA (F780) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | 65nm TSMC low-power | TSMC 65 nm low-power CMOS |
| Configuration Modes | AS, PS, FPP, JTAG | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel |
| Estado RoHS | Compliant | Compliant |
| Device Logic Elements | — | 39,600 |
| Logic Array Blocks (LABs/CLBs) | — | 2,475 |
| Embedded Memory (bits) | — | 1,161,216 |
| Embedded Memory (Kbits) | — | 1,134 |
| Embedded Multipliers (18x18) | — | 126 |
| User I/O Pins | — | 535 |
| I/O Banks | — | 20 |
| Nominal Core Supply Voltage | — | 1.2 V (1.15 V to 1.25 V) |
| Package Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial (-40 °C to +100 °C junction) |
| Nivel MSL | — | 3 |