EP3C40U484C7N vs EP3C40F484C7N Comparación
Comparación detallada lado a lado de EP3C40U484C7N por Intel y EP3C40F484C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C40U484C7N | EP3C40F484C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $119,40 | $264,00 |
| Series | Cyclone® III | — |
| Family | Cyclone III (Low-Power FPGA) | — |
| Logic Elements | 39,600 | 39,600 |
| Total RAM Bits | 1,161,216 | — |
| Number of I/O | 331 (maximum user I/O) | — |
| Number of LABs/CLBs | 2,481 | — |
| Number of Logic Elements/Cells | 39,600 | — |
| Total Memory | 1161216 bit | — |
| Number of PLLs | 4 | — |
| Embedded Multipliers (18x18) | 126 | — |
| Supply Voltage - Core | 1.2 V | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (commercial, C7 speed grade) |
| Encapsulado / Carcasa | 484-FBGA (UBGA, 19x19 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Process Technology | 65 nm TSMC low-k | 65 nm low-power |
| Configuration Method | SRAM (JTAG / Active Serial) | — |
| Estado RoHS | Compliant | Compliant (lead-free FBGA) |
| Lead-Free | Yes | — |
| Device Family | — | Cyclone III |
| Total Memory Bits | — | 1,161,216 |
| Embedded 18x18 Multipliers | — | 126 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| User I/Os | — | 331 |
| Encapsulado | — | 484-FBGA (F484), 1.0 mm pitch |
| Configuration Memory | — | SRAM-based |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, PCI |
| Nivel MSL | — | 3 |