EP3C55F484I8N vs EP3C16F484I7N Comparación
Comparación detallada lado a lado de EP3C55F484I8N por Intel y EP3C16F484I7N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C55F484I8N | EP3C16F484I7N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $61,50 | $36,40 |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LE) | 55,856 | 15408 |
| Logic Array Blocks (LAB) | 3,491 | — |
| Embedded Memory Bits | 2,396,160 bits (approximately 234 Kbytes) | — |
| Embedded Multipliers (18x18) | 312 | 56 |
| PLLs | 4 | [DATA_NEEDED: PLL count from datasheet] |
| User I/O Pins | 327 | 346 |
| I/O Banks | 8 | — |
| Core Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Auxiliary Voltage (VCCAUX) | 2.5 V nominal | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V per bank | — |
| Encapsulado | 484-ball FBGA (FineLine BGA), 23 mm x 23 mm | 484-FBGA (FineLine BGA, 1.0 mm pitch) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de unión de funcionamiento | -40 C to +100 C (industrial, suffix I8) | — |
| Speed Grade | 8 (slowest Cyclone III timing bin) | — |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes (N suffix) |
| Nivel MSL | 3 | — |
| Family | — | Cyclone III |
| Total Memory Bits | — | 516096 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Speed/Grade | — | I7 (industrial, 7 speed grade) |
| Configuration Mode | — | SRAM / JTAG / Passive Serial |