EP3C55F780C7N vs EP3C55F780C6 Comparación
Comparación detallada lado a lado de EP3C55F780C7N por Intel y EP3C55F780C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C55F780C7N | EP3C55F780C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $138,31 | $209,22 |
| Family | Cyclone III | — |
| Logic Elements | 55,856 | 55,856 |
| Embedded Memory | 2,396,160 bits (approximately 2.4 Mbit) | — |
| Embedded Memory Blocks | 312 M9K blocks | — |
| Embedded Multipliers | 156 (18 x 18) | — |
| User I/O Count | 377 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Configuration Memory | 8 Kbits (supports PS, FPP, JTAG) | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low power |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial, C7 speed grade) | 0C to +85C (Commercial) |
| Encapsulado | 780-ball FineLine BGA | 780-ball FBGA |
| Speed Grade | 7 | -6 (C6) |
| Estado RoHS | Compliant | Compliant |
| Series | — | Cyclone III |
| Embedded Memory Bits | — | 2,396,160 |
| Number of Block RAM (M9K) | — | 260 |
| 18x18 Hardware Multipliers | — | 156 |
| User I/Os | — | 377 |
| Configuration Methods | — | JTAG, AS, AP, PS |
| Number of PLLs | — | 4 |
| Maximum User I/O Voltage Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Tipo de montaje | — | Surface Mount (BGA) |