EP3C55F780C7N vs EP3C55F780C6 Vergleich
Detaillierter Direktvergleich von EP3C55F780C7N von Intel und EP3C55F780C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C7N | EP3C55F780C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $138,31 | $209,22 |
| Family | Cyclone III | — |
| Logic Elements | 55,856 | 55,856 |
| Embedded Memory | 2,396,160 bits (approximately 2.4 Mbit) | — |
| Embedded Memory Blocks | 312 M9K blocks | — |
| Embedded Multipliers | 156 (18 x 18) | — |
| User I/O Count | 377 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Configuration Memory | 8 Kbits (supports PS, FPP, JTAG) | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low power |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Betriebstemperatur | 0C to +85C (commercial, C7 speed grade) | 0C to +85C (Commercial) |
| Gehäuse | 780-ball FineLine BGA | 780-ball FBGA |
| Speed Grade | 7 | -6 (C6) |
| RoHS-Status | Compliant | Compliant |
| Series | — | Cyclone III |
| Embedded Memory Bits | — | 2,396,160 |
| Number of Block RAM (M9K) | — | 260 |
| 18x18 Hardware Multipliers | — | 156 |
| User I/Os | — | 377 |
| Configuration Methods | — | JTAG, AS, AP, PS |
| Number of PLLs | — | 4 |
| Maximum User I/O Voltage Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Montageart | — | Surface Mount (BGA) |