EP3C55F780I8N vs EP3CLS200F780I8N Comparación
Comparación detallada lado a lado de EP3C55F780I8N por Intel y EP3CLS200F780I8N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EP3CLS200F780I8N - 198K LE Cyclone III LS FPGA, 780-FBGA | Altera
EP3CLS200F780I8N ⚠ Última compraComparación de especificaciones
| Parámetro | EP3C55F780I8N | EP3CLS200F780I8N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,90 | $495,00 |
| Family | Cyclone III | Cyclone III LS |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,491 | 47 (per FPGAkey brief) |
| Embedded Memory (M9K blocks) | 234 Kbits total | — |
| Embedded 18x18 Multipliers | 156 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/Os | 377 | — |
| Core Supply Voltage | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | Low-power CMOS | 65 nm CMOS |
| Encapsulado | 780-ball FBGA (FineLine BGA), 1.0 mm pitch | 780-ball FBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Operating Temperature (Industrial) | -40C to +100C | — |
| Configuration Method | JTAG / Active Serial / Passive Serial / Fast Passive Parallel | Passive/Active Serial, JTAG |
| Estado RoHS | Compliant | — |
| Logic Elements (LE) | — | 198,464 |
| Embedded Memory (Bits) | — | 8,211,456 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Maximum Internal Clock Frequency | — | 402 MHz |
| Package Code | — | S-PBGA-B780 (JESD-30) |
| Package Body Size | — | 29.0 mm x 29.0 mm |
| Seated Height (Max) | — | 2.40 mm |
| Speed Grade | — | 8 |
| Temperatura de funcionamiento | — | -40 °C to +100 °C (Industrial) |
| RoHS / Lead-Free | — | Pb-free / RoHS compliant |