EP3C5F256I7N vs EP3C5F256C7N Comparación
Comparación detallada lado a lado de EP3C5F256I7N por Intel y EP3C5F256C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C5F256I7N | EP3C5F256C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,00 | $14,20 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Multipliers (18x18) | 26 | 23 |
| PLLs | 2 | 2 |
| Maximum User I/Os | 182 | — |
| Encapsulado | 256-FBGA (FineLine BGA) | 256-LBGA (FineLine BGA, 17x17 mm) |
| Temperatura de funcionamiento | -40C to +125C (Industrial) | 0C to +85C (commercial, per 'C' speed bin) |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | TSMC 65nm low-power | 65 nm low-power CMOS |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | JTAG, AS, AP, PS |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Estado RoHS | Compliant | Compliant (lead-free FBGA) |
| Nivel MSL | 3 (168 hours) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Elements (LEs) | — | 5,136 |
| Logic Array Blocks (LABs) | — | 182 |
| Total Embedded Memory | — | 423,936 bits (414 Kbit) |
| M9K Memory Blocks | — | 46 |
| User I/Os | — | 182 |
| User I/O Banks | — | 8 |
| Speed Grade | — | -7 (commercial, slowest C-tier) |
| Core Voltage | — | 1.2 V (nominal) |
| Lead-Free / Pb-Free | — | Yes (suffix 'N' denotes lead-free) |