EP3C5F256I7N vs EP3C5F256I7 Comparación
Comparación detallada lado a lado de EP3C5F256I7N por Intel y EP3C5F256I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C5F256I7N | EP3C5F256I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,00 | $22,36 |
| Family | Cyclone III | — |
| Logic Elements | 5,136 | 5136 |
| Total Memory Bits | 423,936 bits | — |
| Embedded Multipliers (18x18) | 26 | — |
| PLLs | 2 | — |
| Maximum User I/Os | 182 | — |
| Encapsulado | 256-FBGA (FineLine BGA) | — |
| Temperatura de funcionamiento | -40C to +125C (Industrial) | — |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | TSMC 65nm low-power | — |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | — |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Estado RoHS | Compliant | — |
| Nivel MSL | 3 (168 hours) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| FPGA Family | — | Cyclone III |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Total RAM Bits | — | 423936 bits |
| Maximum User I/O Count | — | 182 |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA-256) |
| Package Shape | — | Square |
| Number of Terminals | — | 256 |
| Terminal Form | — | Ball |
| Technology | — | CMOS |
| Maximum Operating Frequency | — | 472.5 MHz |
| Rango de temperatura de funcionamiento | — | -40C to 125C |
| Speed Grade | — | 7 (per -7 order code) |
| Temperature Grade | — | I (industrial, per -I7 order code) |
| Lead-Free Finish | — | Yes (per distributor listing) |
| Core Supply Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O supply voltage] |