EP3CLS100F484C7N vs EP3CLS200F484C7N Comparación
Comparación detallada lado a lado de EP3CLS100F484C7N por Intel y EP3CLS200F484C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS100F484C7N | EP3CLS200F484C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $495,80 | $1.650,00 |
| Family | Cyclone III LS | — |
| Logic Elements | 100,448 | — |
| Embedded Memory (bits) | 4,451,328 | — |
| User I/O Pins | 278 | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| PLLs | 4 | 4 |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Process Technology | 65 nm low-power (TSMC) | 65 nm low-power CMOS |
| Core Supply Voltage | 1.2 V | — |
| Operating Temperature (junction) | 0°C to +85°C (commercial) | — |
| Speed Grade | C7 | — |
| Encapsulado | 484-ball FineLine BGA (FBGA-484) | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | [DATA_NEEDED: package body dimensions] | — |
| Configuration Method | SRAM-based (volatile), via EPCS/JTAG/parallel flash | — |
| Security Features | Bitstream encryption, JTAG tamper protection | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant (lead-free, N suffix) | Compliant |
| Design Software | Quartus II / Intel Quartus Prime | — |
| Series | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 12,404 |
| Embedded Memory | — | 8,211,456 bits |
| Embedded 18x18 Multipliers | — | 210 |
| User I/O | — | 226 |
| Core Voltage | — | 1.2 V |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Configuration Modes | — | AS, PS, JTAG (IEEE 1149.1) |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | — | 8 |
| Hot Socketing | — | Supported |