EP3CLS150F484C7 vs EP3CLS200F484C7 Comparación
Comparación detallada lado a lado de EP3CLS150F484C7 por Intel y EP3CLS200F484C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS150F484C7 | EP3CLS200F484C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $720,00 | $1.720,00 |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 149,760 | 198,464 |
| Total Memory Bits | 6,138,560 | — |
| Embedded Multipliers (18x18) | 396 | — |
| User I/O Count | 210 | — |
| Configuration Logic Blocks (CLBs) | 150,848 | — |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 210 | — |
| Encapsulado | 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch |
| Process Technology | 60 nm TSMC low-power CMOS | CMOS, low-power |
| Supply Voltage Core (VCCINT) | 1.2 V | — |
| Supply Voltage Auxiliary (VCCAUX) | 2.5 V | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| AES Bitstream Encryption | AES-256 with 64-bit volatile key | — |
| Logic Array Blocks (LABs) | — | 12,408 |
| Embedded Memory (RAM bits) | — | 8,211,456 |
| Maximum User I/Os | — | 226 |
| DSP Blocks | — | 396 (18x18 multipliers) |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| I/O Supply Voltage (VCCIO) | — | 1.2 V to 3.3 V |
| Temperatura de funcionamiento | — | 0C to +85C (commercial, C7 speed grade) |
| Configuration Method | — | JTAG, Passive Serial, Active Serial |