EP3CLS150F484C8 vs EP3CLS200F484C8 Comparación
Comparación detallada lado a lado de EP3CLS150F484C8 por Intel y EP3CLS200F484C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS150F484C8 | EP3CLS200F484C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $119,00 | $118,00 |
| Family | Cyclone III LS | Cyclone III LS (low-power Cyclone III) |
| Logic Elements (LE) | 150848 | 198,464 |
| Embedded Memory Bits | 6137856 | — |
| Total RAM Blocks | [DATA_NEEDED: number of M9K blocks] | — |
| User I/O Count | 210 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | [DATA_NEEDED: number of global clocks] | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Temperatura de funcionamiento | 0 C to +85 C (commercial) | 0C to +85C (commercial, 'C' suffix) |
| Speed Grade | C8 | — |
| Maximum Internal Frequency | 402 MHz | — |
| Encapsulado | 484-ball FBGA | 484-pin FBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Configuration Memory | SRAM-based, AES bitstream encryption supported | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED] | — |
| Series | — | Cyclone III LS |
| Logic Array Blocks (LAB) | — | 20,5056 (approx) |
| Embedded Memory | — | 8,211,456 bits (approx 8 Mbit) |
| Embedded 18x18 Multipliers | — | 210 |
| Maximum User I/O | — | 304 |
| I/O Banks | — | 8 |
| Package Dimensions | — | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Security | — | Design encryption / bitstream AES |