EP3CLS200F780I7N vs EP3SE110F780I3 Comparación
Comparación detallada lado a lado de EP3CLS200F780I7N por Intel y EP3SE110F780I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS200F780I7N | EP3SE110F780I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $240,00 | $1.395,00 |
| Device Family | Cyclone III LS | — |
| Series | EP3CLS200 | — |
| Logic Elements | 198,464 | 107500 |
| Logic Array Blocks (LABs) | 12,404 LAB | — |
| Embedded Memory (bits) | 8,211,456 | — |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | — |
| Maximum User I/O | 413 | — |
| Process Technology | 65 nm CMOS (low-power) | 65 nm |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Speed Grade | 7 | — |
| Temperatura de funcionamiento | -40 °C to +100 °C (industrial) | -40C to +100C (industrial) |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | — |
| Encapsulado | 780-ball FBGA (FBGA-780) | — |
| Ball Pitch | 1.0 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant (lead-free per FBGA-780 datasheet note) | unknown |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| Family | — | Stratix III E |
| Number of LABs/CLBs | — | 4300 |
| Number of Logic Elements/Cells | — | 107500 |
| Total RAM Bits | — | 8936448 |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 1.1 V core |
| Encapsulado / Carcasa | — | 780-BBGA, FCBGA (FineLine BGA) |
| Supplier Device Package | — | 780-FBGA |
| Nivel de sensibilidad a la humedad (MSL) | — | unknown |
| Grade | — | Industrial |