EP3CLS200F780I7N vs EP3SE110F780I3 对比
详细并排对比 EP3CLS200F780I7N 出自 Intel 和 EP3SE110F780I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3CLS200F780I7N | EP3SE110F780I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $240.00 | $1,395.00 |
| Device Family | Cyclone III LS | — |
| Series | EP3CLS200 | — |
| Logic Elements | 198,464 | 107500 |
| Logic Array Blocks (LABs) | 12,404 LAB | — |
| Embedded Memory (bits) | 8,211,456 | — |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | — |
| Maximum User I/O | 413 | — |
| Process Technology | 65 nm CMOS (low-power) | 65 nm |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Speed Grade | 7 | — |
| 工作温度 | -40 °C to +100 °C (industrial) | -40C to +100C (industrial) |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | — |
| 封装 | 780-ball FBGA (FBGA-780) | — |
| Ball Pitch | 1.0 mm | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant (lead-free per FBGA-780 datasheet note) | unknown |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| Family | — | Stratix III E |
| Number of LABs/CLBs | — | 4300 |
| Number of Logic Elements/Cells | — | 107500 |
| Total RAM Bits | — | 8936448 |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 1.1 V core |
| 封装 / 外壳 | — | 780-BBGA, FCBGA (FineLine BGA) |
| Supplier Device Package | — | 780-FBGA |
| 湿敏等级（MSL） | — | unknown |
| Grade | — | Industrial |