EP3CLS70F780I7 vs EP3CLS70F780I7N Comparación
Comparación detallada lado a lado de EP3CLS70F780I7 por Intel y EP3CLS70F780I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ ActivoComparación de especificaciones
| Parámetro | EP3CLS70F780I7 | EP3CLS70F780I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $125,00 | $880,00 |
| Family | Cyclone III LS | — |
| Logic Elements (LEs) | 70,208 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 3,068,928 bits (2.93 Mbit) | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| Hardware Multipliers (18x18) | 413 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/Os | 429 | — |
| Encapsulado | 780-ball FBGA (1.0 mm pitch, 29 x 29 mm) | — |
| Operating Temperature (Industrial, 'I') | -40C to +100C (case) | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Configuration Support | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) | — |
| Bitstream Encryption | AES-128/256 (LS-family feature) | — |
| Process Node | 60 nm TSMC low-power | — |
| Estado RoHS | Non-compliant (per Cyclone III LS datasheet prefix per verified data) | unknown |
| Speed Grade | 7 (moderate) | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Cyclone III LS |
| Logic Elements | — | 70,208 |
| Embedded Memory | — | 3,068,928 bits |
| Maximum User I/O | — | 413 pins |
| Tensión de alimentación | — | 1.2 V |
| Temperature Grade | — | Industrial |
| Package Type | — | BGA |
| Package Pin Count | — | 780 balls |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Configuration Technology | — | SRAM-based FPGA |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature] |
| Tipo de montaje | — | Surface Mount |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |