EP3CLS70F780I7 vs EP3CLS70F780I7N Comparaison
Comparaison détaillée côte à côte de EP3CLS70F780I7 par Intel et EP3CLS70F780I7N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ ActifComparaison des spécifications
| Paramètre | EP3CLS70F780I7 | EP3CLS70F780I7N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $125,00 | $880,00 |
| Family | Cyclone III LS | — |
| Logic Elements (LEs) | 70,208 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 3,068,928 bits (2.93 Mbit) | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| Hardware Multipliers (18x18) | 413 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/Os | 429 | — |
| Boîtier | 780-ball FBGA (1.0 mm pitch, 29 x 29 mm) | — |
| Operating Temperature (Industrial, 'I') | -40C to +100C (case) | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Configuration Support | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) | — |
| Bitstream Encryption | AES-128/256 (LS-family feature) | — |
| Process Node | 60 nm TSMC low-power | — |
| Statut RoHS | Non-compliant (per Cyclone III LS datasheet prefix per verified data) | unknown |
| Speed Grade | 7 (moderate) | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Cyclone III LS |
| Logic Elements | — | 70,208 |
| Embedded Memory | — | 3,068,928 bits |
| Maximum User I/O | — | 413 pins |
| Tension d'alimentation | — | 1.2 V |
| Temperature Grade | — | Industrial |
| Package Type | — | BGA |
| Package Pin Count | — | 780 balls |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Configuration Technology | — | SRAM-based FPGA |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature] |
| Type de montage | — | Surface Mount |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |