EP3SE110F780C3N vs EP3SE110F780I3 Comparación
Comparación detallada lado a lado de EP3SE110F780C3N por Intel y EP3SE110F780I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE110F780C3N | EP3SE110F780I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.245,00 | $1.395,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | — |
| User I/Os | 488 | — |
| Encapsulado | 780-ball FCBGA (Flip-Chip BGA) | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | — |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Estado RoHS | Compliant | unknown |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Logic Elements | — | 107500 |
| Number of LABs/CLBs | — | 4300 |
| Number of Logic Elements/Cells | — | 107500 |
| Total RAM Bits | — | 8936448 |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 1.1 V core |
| Temperatura de funcionamiento | — | -40C to +100C (industrial) |
| Encapsulado / Carcasa | — | 780-BBGA, FCBGA (FineLine BGA) |
| Supplier Device Package | — | 780-FBGA |
| Nivel de sensibilidad a la humedad (MSL) | — | unknown |
| Grade | — | Industrial |