EP3SE110F780C3N vs EP3SE110F780I3 对比
详细并排对比 EP3SE110F780C3N 出自 Intel 和 EP3SE110F780I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE110F780C3N | EP3SE110F780I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,245.00 | $1,395.00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | — |
| User I/Os | 488 | — |
| 封装 | 780-ball FCBGA (Flip-Chip BGA) | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | — |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| RoHS 状态 | Compliant | unknown |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| Logic Elements | — | 107500 |
| Number of LABs/CLBs | — | 4300 |
| Number of Logic Elements/Cells | — | 107500 |
| Total RAM Bits | — | 8936448 |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 1.1 V core |
| 工作温度 | — | -40C to +100C (industrial) |
| 封装 / 外壳 | — | 780-BBGA, FCBGA (FineLine BGA) |
| Supplier Device Package | — | 780-FBGA |
| 湿敏等级（MSL） | — | unknown |
| Grade | — | Industrial |