EP3SE110F780C4 vs EP3SE110F780C3N Comparación
Comparación detallada lado a lado de EP3SE110F780C4 por Intel y EP3SE110F780C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE110F780C4 | EP3SE110F780C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.380,00 | $1.245,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| Embedded Memory | 8,936,448 bits (8.9 Mbit) | TriMatrix (MLAB + M9K + M144K) |
| DSP Blocks (18x18 Multipliers) | 896 | — |
| Maximum User I/O | 488 | — |
| Encapsulado | 780-ball FCBGA (FineLine BGA) | 780-ball FCBGA (Flip-Chip BGA) |
| Speed Grade | C4 | — |
| Process Node | 40 nm | — |
| Transceiver Data Rate | Up to 1.6 Gbps | — |
| Memory Interface Support | DDR3 up to 800 MHz | — |
| Temperatura de funcionamiento | Commercial (0C to +85C) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Configuration | Partial Reconfiguration support | — |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| Maximum Operating Frequency | — | 500 MHz |
| DSP Blocks | — | Yes (integrated, count varies by configuration) |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |