EP3SE110F780C4L vs EP3SE110F780I4L Comparación
Comparación detallada lado a lado de EP3SE110F780C4L por Intel y EP3SE110F780I4L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE110F780C4L | EP3SE110F780I4L |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.550,00 | $1.395,00 |
| Series | Stratix III E | — |
| Number of Logic Elements (LE) | 107,500 | — |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: number of LABs] | — |
| Total Memory Bits | 8,936,448 bits | — |
| Number of 18x18 Multipliers | 488 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| User I/O Pins | 488 | — |
| Speed Grade | -4 (commercial) | — |
| Process Variant | L (low-leakage) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Package Type | 780-Ball FCBGA | — |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Tipo de montaje | Surface Mount | Surface Mount (FC-FBGA) |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Estado RoHS | Compliant | Compliant (per legacy Altera data) |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III E |
| Logic Elements | — | 107,500 |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Embedded Memory | — | 8,936,448 bits (8.9 Mbit) |
| Maximum Operating Frequency | — | 375 MHz |
| Core Voltage | — | 0.9 V |
| Encapsulado | — | 780-pin FC-FBGA (Flip-Chip BGA) |
| Package Body Size | — | 29 mm × 29 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Product Status | — | Not Recommended for New Designs (NRND) |