EP3SE110F780C4L vs EP3SE110F780I4L Comparaison
Comparaison détaillée côte à côte de EP3SE110F780C4L par Intel et EP3SE110F780I4L par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SE110F780C4L | EP3SE110F780I4L |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 550,00 | $1 395,00 |
| Series | Stratix III E | — |
| Number of Logic Elements (LE) | 107,500 | — |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: number of LABs] | — |
| Total Memory Bits | 8,936,448 bits | — |
| Number of 18x18 Multipliers | 488 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| User I/O Pins | 488 | — |
| Speed Grade | -4 (commercial) | — |
| Process Variant | L (low-leakage) | — |
| Température de fonctionnement | 0C to +85C (commercial) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Package Type | 780-Ball FCBGA | — |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Type de montage | Surface Mount | Surface Mount (FC-FBGA) |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Statut RoHS | Compliant | Compliant (per legacy Altera data) |
| Niveau MSL | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III E |
| Logic Elements | — | 107,500 |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Embedded Memory | — | 8,936,448 bits (8.9 Mbit) |
| Maximum Operating Frequency | — | 375 MHz |
| Core Voltage | — | 0.9 V |
| Boîtier | — | 780-pin FC-FBGA (Flip-Chip BGA) |
| Package Body Size | — | 29 mm × 29 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Product Status | — | Not Recommended for New Designs (NRND) |