EP3SE260F1152C4LN vs EP3SE260F1152C3N Comparación
Comparación detallada lado a lado de EP3SE260F1152C4LN por Intel y EP3SE260F1152C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
EP3SE260F1152C4LN ⚠ Última compraIntel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ ActivoComparación de especificaciones
| Parámetro | EP3SE260F1152C4LN | EP3SE260F1152C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.400,00 | $7.500,00 |
| Family | Stratix III E | — |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| User I/Os | 744 | — |
| Encapsulado | 1152-ball FC-BGA | 1152-BBGA, FCBGA |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 0.9 V | 1.1 V |
| Core Clock Speed | 375 MHz (max) | — |
| Transceiver Data Rate | 717 MHz | — |
| Speed Grade | C4 | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0 C to +85 C (Commercial) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | Compliant | Compliant |
| Series | — | Stratix III E |
| Logic Elements / Cells | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| User I/O Count | — | 744 |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |